Adino UF Adhesive

Adino UF 1959.0 with the lowest formaldehyde content

Application:
‧ Bonding of veneer, decor paper and HPL/CPL materials to wood-based panels in hot presses
‧ Solid wood bonding
‧ Manufacturing of multi-layered formed parts in HF presses
‧ Production of low emission plywood boards

Characteristics:
‧ One-shot powder glue
‧ Easy one-step mixing with water
‧ Minimized bleeding through
‧ Lowest formaldehyde content, comply with UBO E0.5 according to EN 717 chamber test ; CARB P2 , TSCA TVI acc. ASTM E 1333 and D 6007 1333.
‧ Lower emission classes possible, depending on used substrate material.
‧ Meets requirements EN 314 Type

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